BuildSys 2018 — Call for Participation

5th ACM International Conference on Systems for Energy-Efficient Built Environments (BuildSys 2018)

November 7-8, 2018, Shenzhen, China
http://buildsys.acm.org/2018/

Call for Participation
We are happy and excited to announce the program this year!  For a sneak peak, please check out the web links here:
http://buildsys.acm.org/2018/program/

This year, SenSys 2018 and BuildSys 2018 will be co-located and held at Shenzhen, China. You are cordially invited to share your research with the community and to visit the fastest growing city of China. Shenzhen is a heavily industrialized area and a new technology hub. It hosts the headquarters of Huawei, Tencent, ZTE, DJI, TP-Link, BYD, Skyworth, to name but a few.

Registration Information is available at
http://buildsys.acm.org/2018/registration/

Travel and Visa
SenSys 2018 and Buildsys 2018 will be held in the Shenzhen Sea World Culture and Arts Center. The conference hotel is Hilton Shenzhen Shekou Nanhai.

Shenzhen is neighboring to Hong Kong. For example, there is direct ferry service from Hong Kong international airport.

You may need a visa to enter China. Please make preparation early! Many nationalities are eligible for 1 to 10 year VISA if applying in advance. Although some countries are eligible for 5-day VISA, when entering Shenzhen at certain ports from Hong Kong, or other transit visas, but do keep in mind that regulation do change on a regular basis. Please check your local embassy websites or travel agents for visa services. If a visa support letter is needed, please contact Dr. Kai Zhang (email: zhangkai@sz.tsinghua.edu.cn). Please provide your details (full name, address, affiliation and gender), as well as other relevant information (publication title, etc.)

For details of the venue, hotel booking, and visa letter, check out this page: http://buildsys.acm.org/2018/venue/